Kinwong News

Kinwong Self-luminous Mini-LED Backlight module project won jiangxi Science and Technology Progress Award! Kinwong won the third prize of Jiangxi Provincial Science and Technology Progress Award for his “Research and Application of Self-luminous Mini-LED Backlight Module LCD Photoelectric Panel Technology”. As a new generation of display technology, mini-LED backlight products are widely used in tablet computers, laptop computers, vehicle-mounted applications, TV and VR display devices with its advantages of long life, high brightness, high contrast,

On April 15, 2022, the China Intellectual Property Office announced the evaluation results of the 23rd China Patent Award. Kinwong’s multi-layer PCB production method and multi-layer PCB board won the China Patent Excellence Award. The China Patent Award is co-sponsored by the China Intellectual Property Office and the World Intellectual Property Organization. It is a government department award at the national level that rewards inventions and creations with patent rights. It is an authoritative award

Recently, the Jiangxi Provincial Department of Industry and Information Technology announced the list of 2021 annual management innovation demonstration enterprises. With its innovative achievements in strategic management, information management, production management, cost management, human resources management and supply chain management, Jiangxi Kinwong was rated as “Demonstration Enterprise of Management Innovation in Jiangxi Province”.  

Recently, with the approval of the Talent Office of the Jiangxi Provincial Party Committee and the Jiangxi Provincial Department of Human Resources and Social Security, Jiangxi Kinwong was approved to set up a post-doctoral innovation experimental base. This is the government’s major recognition of Kinwong’s achievements in scientific research and innovation, high-level talent training, etc. It will help Jiangxi Kinwong to promote the integration of production, education and research. Jiangxi Kinwong is a high-end PCB

Interposer packaging, as the current mainstream advanced packaging technology, mainly focuses on three aspects: light, thin and compact, high-speed signal, density and pitch reduction. It puts forward extremely strict requirements for PCB wiring density, signal integrity, and reliability. Kinwong Zhuhai SLP factory has developed 9-N-9 HDI Interposer products with end customers, which are applied to high-performance CPUs, including buried and blind via designs and use low loss & ultra low loss high speed materials for

Shenzhen Kinwong Electronic Co., Ltd. (multilayer boards, flexible boards) and Kinwong Electronic Technology (Longchuan) Co., Ltd. (multilayer boards, flexible boards, metal-based circuit boards) enter the third batch of lists that meet the “standard conditions for the printed circuit industry” issued by the Ministry of Industry and Information Technology of the People’s Republic of China. The Ministry of Industry and Information Technology has formulated the “Regulations for the Printed Circuit Board Industry”, which aims to promote